COME 计算模块
COME Type 6计算模块

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COM Express, defined by the PCI Industrial Computer Manufactures Group (PICMG), is the most successful Computer-On-Module (COM) standard in the embedded market today. COM Express employs a mezzanine-based approach, whereby an off-the-shelve module with two 220-pin board-to-board connectors, plugs into a custom, application-specific carrier board.
The COM Express form factor defines mini-, compact-, basic-, and extended-size modules. Each size focuses on specific application areas and power envelopes.

About COM Express Type 6

The release of COM Express COM.0 Revision 3.1 brings this widely-adopted Computer-on-Module form factor in line with current and future technology trends by providing support for advanced interfaces, such as PCI Express Gen 4 and USB 4. Other interfaces added include General Purpose SPI and options for MIPI-CSI and SoundWire.

What is the COM Express Type 6?

COM Express Basic size Type 6 is the most popular and widely used computer-on-module form factor on the market. With pinouts closely matching the feature set of common x86 based silicon, two COM Express connectors allow for designs of up to 75 watts. The Type 6 pinout has a strong focus on multiple modern display outputs targeting applications such as medical, gaming, test and measurement and industrial automation.

The COM Express Compact Type 6 form factor is ideally suited to single chip x86 solutions (SoCs) with a power range between 5 to 20 watts. To reach this kind of low power envelopes peak performance and feature sets have been reduced compared to silicon used on the Basic size modules. Utilizing both Intel® Core™ and Atom® SoCs, Compact size modules are typically targeted at mid- and entry level applications such as transportation, robotics, edge servers, industrial control, and HMIs in the industrial and medical fields.



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COM Express® Carrier Design Guide_2.0.pdf

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